JPS5113374U - - Google Patents

Info

Publication number
JPS5113374U
JPS5113374U JP1974085100U JP8510074U JPS5113374U JP S5113374 U JPS5113374 U JP S5113374U JP 1974085100 U JP1974085100 U JP 1974085100U JP 8510074 U JP8510074 U JP 8510074U JP S5113374 U JPS5113374 U JP S5113374U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1974085100U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974085100U priority Critical patent/JPS5113374U/ja
Publication of JPS5113374U publication Critical patent/JPS5113374U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Measurement Of Current Or Voltage (AREA)
JP1974085100U 1974-07-17 1974-07-17 Pending JPS5113374U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1974085100U JPS5113374U (en]) 1974-07-17 1974-07-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974085100U JPS5113374U (en]) 1974-07-17 1974-07-17

Publications (1)

Publication Number Publication Date
JPS5113374U true JPS5113374U (en]) 1976-01-30

Family

ID=28266866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974085100U Pending JPS5113374U (en]) 1974-07-17 1974-07-17

Country Status (1)

Country Link
JP (1) JPS5113374U (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494707U (en]) * 1977-12-16 1979-07-04
JPS60185402U (ja) * 1984-05-21 1985-12-09 内藤 穣 スクリユ−オ−ガ形かごロ−タ
JPS6120105U (ja) * 1984-07-11 1986-02-05 有限会社 工藤農機 かご型整地ロ−ラ−

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ELECTRONICS=1974 *
MACHINE DESIGN#N5=1974 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494707U (en]) * 1977-12-16 1979-07-04
JPS60185402U (ja) * 1984-05-21 1985-12-09 内藤 穣 スクリユ−オ−ガ形かごロ−タ
JPS6120105U (ja) * 1984-07-11 1986-02-05 有限会社 工藤農機 かご型整地ロ−ラ−

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